Light-emitting structure

ABSTRACT

A light-emitting structure includes an epitaxial structure including a plurality of trenches; a conductive connecting layer, disposed under the epitaxial structure; a first isolation layer; a crossover metal layer, disposed under the first isolation layer and including a plurality of protruding portions protruding into the epitaxial structure through the plurality of trenches; a second isolation layer, disposed under the crossover metal layer; a bonding layer disposed under the second isolation layer; a substrate, disposed under the bonding layer; and an electrode, electrically connected to the conductive connecting layer and disposed adjacent to the epitaxial structure in a cross-sectional view.

REFERENCE TO RELATED APPLICATION

This application is a continuation application of U.S. Ser. No. 15/401,850 entitled “LIGHT-EMITTING STRUCTURE”, filed on Jan. 9, 2017, now U.S. Pat. No. 9,825,090, which is a continuation application of U.S. Ser. No. 14/954,708 entitled “LED ARRAY”, filed on Nov. 30, 2015, now U.S. Pat. No. 9,553,127, which is a divisional application of U.S. Ser. No. 14/330,914, entitled “LED ARRAY”, filed on Jul. 14, 2014, now U.S. Pat. No. 9,202,981, which is a division of U.S. patent application Ser. No. 14/065,330, entitled “LED ARRAY”, filed on Oct. 28, 2013, now U.S. Pat. No. 8,779,449, which is a division of U.S. patent application Ser. No. 13/428,974, entitled “LED ARRAY”, filed on Mar. 23, 2012, now U.S. Pat. No. 8,569,775, which claims the right of priority based on Taiwan patent application Ser. No. 100110029, filed on Mar. 23, 2011, now Pat. No. TW I488331, the entireties of which are incorporated by reference herein.

TECHNICAL FIELD

The application relates to a light-emitting structure, and more particularly to a light-emitting structure having protrusion portion.

DESCRIPTION OF BACKGROUND ART

Recently, based on the progress of epitaxy process technology, the light-emitting diode(LED) becomes one of the potential solid-state lighting (SSL) source. Due to the limitation of physics mechanism, LEDs can only be driven by DC power source. Thus the regulator circuit, buck circuit, and other electronic devices are necessary for every lighting device using LED as lighting source to convert AC power source into DC power source to drive LED. However, the addition of the regulator circuit, buck circuit, and other electronic device raises the cost of lighting device using LED as lighting source and causes the low AC/DC conversion efficiency and the huge lighting device package also affect the reliability and shorten the lifetime of LED in daily use.

SUMMARY OF THE DISCLOSURE

The present application discloses a light-emitting structure including: an epitaxial structure including a plurality of trenches; a conductive connecting layer, disposed under the epitaxial structure; a first isolation layer; a crossover metal layer, disposed under the first isolation layer and including a plurality of protruding portions protruding into the epitaxial structure through the plurality of trenches; a second isolation layer, disposed under the crossover metal layer; a bonding layer disposed under the second isolation layer; a substrate, disposed under the bonding layer; and an electrode, electrically connected to the conductive connecting layer and disposed adjacent to the epitaxial structure in a cross-sectional view.

The present application discloses a light-emitting structure including a first epitaxial unit; a second epitaxial unit disposed next to the first epitaxial unit; a crossover metal layer including a first protruding portion laterally overlapping the first epitaxial unit and the second epitaxial unit wherein the first protruding portion is electrically connected with the first epitaxial unit and the second epitaxial unit; a conductive connecting layer disposed below the first epitaxial unit and the second epitaxial unit and surrounding the first protruding portion; and an electrode arranged on the conductive connecting layer.

The present application discloses a light-emitting structure including a light-emitting unit; a crossover metal layer including a protruding portion laterally overlapping the light-emitting unit, wherein the protruding portion is electrically connected with the light-emitting unit; a conductive connecting layer disposed below the light-emitting and surrounding the protruding portion; and an electrode arranged on the conductive connecting layer; wherein a top surface of the protruding portion contacts a surface of the light-emitting unit or the protruding portion is devoid of passing through the first epitaxial unit.

The present application discloses an LED array including a permanent substrate, a bonding layer on the permanent substrate, a second conductive layer on the bonding layer, a second isolation layer on the second conductive layer, a crossover metal layer on the second isolation layer, a first isolation layer on the crossover metal layer, a conductive connecting layer on the first isolation layer, an epitaxial structure on the conductive connecting layer, and a first electrode layer on the epitaxial structure.

The present application further discloses an LED array including a permanent substrate, a bonding layer on the permanent substrate, a first conductive layer on the bonding layer, a second isolation layer on the first conductive layer, a crossover metal layer on the second isolation layer, a first isolation layer on the crossover metal layer, a conductive connecting layer on the first isolation layer, and an epitaxial structure on the conductive connecting layer.

The present application further discloses an Led array having N light-emitting diode units (N≥3) and the light-emitting diode units are electrically connected with each other by the crossover metal layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1I are the cross sectional views of the LED array in accordance of the first embodiment of present application.

FIGS. 1A′-1G′ are the top views of the first embodiment of LED array disclosed by present application.

FIGS. 2A-2I are the cross sectional views of the second embodiment of LED array disclosed by present application.

FIGS. 2A′-2G′ are the top views of the second embodiment of LED array disclosed by present application.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The present application discloses an LED array having N light-emitting diode units (N≥3) comprising a first light-emitting diode unit, a second light-emitting diode unit in sequence to the (N−1)^(th) light-emitting diode unit and an N^(th) light-emitting diode unit. The LED array further comprises a first area (I), the second area (II), and the third area (III). The first area (I) comprises the first light-emitting diode unit, the third area (III) comprises the N^(th) light-emitting diode unit, and the second area (II) locates between the first area (I) and the third area (III) and comprises the second light-emitting diode unit in sequence to the (N−1)^(th) diode units.

The first embodiment discloses a first LED array 1 having three light-emitting diode units. FIGS. 1A to 1I illustrate the cross sectional views and the FIGS. 1A′ to 1G′ illustrate the top views of the first embodiment of the first LED array 1. The method for manufacturing the first LED array 1 comprises steps of:

-   -   1. Providing a temporary substrate 11, and forming an epitaxial         structure thereon. The epitaxial structure comprises a first         conductive semiconductor layer 12, an active layer 13, and a         second conductive semiconductor layer 14 as illustrated in FIGS.         1A and 1A′.     -   2. Next, forming multiple trenches 15 by partially etching the         epitaxial structure in the first area (I) and the second area         (II), and the epitaxial structure not etched forms multiple flat         planes 16, and the epitaxial structure of the third area (III)         is not etched as illustrated in FIGS. 1B and 1B′.     -   3. Forming a conductive connecting layer 17 on partial regions         of the flat planes 16, and the area of the flat planes 16         uncovered by the conductive connecting layer 17 forms multiple         pathways 18 as illustrated in FIGS. 1C and 1C′.     -   4. Forming a first isolation layer 19 on part of the conductive         connecting layer 17, the multiple pathways 18, and the side wall         of the multiple trenches 15, while the conductive connecting         layer 17 in the third area (III) and part of the conductive         connecting layer 17 in the first area (I) are not covered by the         first isolation layer 19. The conductive connecting layer 17 not         covered by the first isolation layer 19 in the second area (II)         is defined as a conductive region 20 as illustrated in FIGS. 1D         and 1D′.     -   5. Forming a crossover metal layer 21 on the first isolation         layer 19, the conductive region 20, in multiple trenches 15, and         on the conductive connecting layer 17 in the third area (III). A         part of the conductive connecting layer 17 in the first area (I)         is not covered by the crossover metal layer 21 in order to         electrically connect the second conductive layer 23 with the         second conductive semiconductor layer 14 in the following steps.         The region which is not covered by the crossover metal layer 21         in the second area (II) nearby the conductive region 20 is used         for electrical isolation as illustrated in the FIGS. 1E and 1E′.         Part of the crossover metal layer 21 in the first area (I)         extends to multiple trenches 15 and electrically connects to the         first conductive semiconductor layer 12. The crossover metal         layer 21 on multiple flat planes 16 and the pathways 18 in the         first area (I) is electrically isolated from the second         conductive semiconductor layer 14 by the first isolation layer         19. The crossover metal layer 21 on the conductive region 20 in         the second area (II) electrically connects with the second         conductive semiconductor layer 14 by the conductive connecting         layer 17. Part of the crossover metal layer 21 in the second         area (II) extends to multiple trenches 15 and electrically         connects to the first conductive semiconductor layer 12. The         crossover metal layer 21 on multiple flat planes 16 and the         pathways 18 in the second area (II) is electrically isolated         from the second conductive semiconductor layer 14 by the first         isolation layer 19. The crossover metal layer 21 in the third         area (III) is electrically connected with the second conductive         semiconductor layer 14 by the conductive connecting layer 17.     -   6. Forming a second isolation layer 22 on the crossover metal         layer 21 and the region a in the second area (II). But part of         the conductive connecting layer 17 in the first area (I) is not         covered by the second isolation layer 22 as illustrated in the         FIGS. 1F and 1F′.     -   7. Forming the second conductive layer 23 on the second         isolation layer 22 and part of the conductive connecting layer         17 as illustrated in the as illustrated in the FIGS. 1G and 1G′.     -   8. Forming a bonding layer 24 on the second conductive layer 23         which is bonded with a permanent substrate 25 by the bonding         layer 24 as illustrated in the FIG. 1H.     -   9. Removing the temporary substrate 11 to expose the first         conductive semiconductor layer 12 and roughening the surface of         the first conductive semiconductor layer 12. Next, etching         multiple pathways 18 from the first conductive semiconductor         layer 12 until the first isolation layer 19 is revealed in order         to form N light-emitting diode units. Among the N light-emitting         diode units, the first light-emitting diode unit locates in the         first area (I), the second to the (N−1)^(th) light-emitting         diode units locate in the second area (II), and the N^(th)         light-emitting diode unit locates in the third area (III). At         last, forming a first electrode layer 27 on the roughed surface         of the first conductive semiconductor layer 12 in the N^(th)         light-emitting diode unit. Thus an LED array 1 having N         light-emitting diode units electrically connected in serial by         the crossover metal layer 21 is formed as illustrated in FIG.         1I.

The second embodiment discloses a second LED array 2 having three light-emitting diode units. FIGS. 2A to 2I illustrate the cross sectional views and the FIGS. 2A′ to 2G′ illustrate the top views of the second embodiment of LED array 2. The method for manufacturing the second LED array 2 comprises steps of:

-   -   1. Providing a temporary substrate 11, and forming an epitaxial         structure thereon. The epitaxial structure comprises a first         conductive semiconductor layer 12, an active layer 13, and a         second conductive semiconductor layer 14 as illustrated in FIGS.         2A and 2A′.     -   2. Next, forming multiple trenches 15 by partially etching the         epitaxial structure in the first area (I), the second area (II),         and the third area (III), and the epitaxial structure not etched         forms multiple flat planes 16 as illustrated in FIGS. 2B and         2B′.     -   3. Forming a conductive connecting layer 17 on partial regions         of the flat planes 16, and the area of the flat planes 16         uncovered by the conductive connecting layer 17 forms multiple         pathways 18 as illustrated in FIGS. 2C and 2C′.     -   4. Forming a first isolation layer 19 on part of the conductive         connecting layer 17, the multiple pathways 18, and the side wall         of the multiple trenches 15. The conductive connecting layer 17         in the second area (II) and the third area (III) which is not         covered by the first isolation layer 19 are defined as a         conductive region 20 as illustrated in FIGS. 2D and 2D′.     -   5. Forming a crossover metal layer 21 on the first isolation         layer 19, the conductive region 20, and in the multiple trenches         15 except those in the third area (III). A part of the first         isolation layer 19 in the first area (I) is not covered by the         crossover metal layer 21 in order to electrically isolate the         first conductive layer 26 from the second conductive         semiconductor layer 14 in the following steps. The first         isolation layer 19 in multiple trenches 15 and flat planes 16 is         not covered by the crossover metal layer 21 in order to         electrically isolate the first conductive layer 26 from the         second conductive semiconductor layer 14 in the following steps         as illustrated in the FIGS. 2E and 2E′. A part of the crossover         metal layer 21 in the first area (I) extends to multiple         trenches 15 and electrically connects to the first conductive         semiconductor layer 12. The crossover metal layer 21 on multiple         flat planes 16 and the pathways 18 in the first area (I) is         electrically isolated from the second conductive semiconductor         layer 14 by the first isolation layer 19. The crossover metal         layer 21 on the conductive region 20 in the second area (II)         electrically connects with the second conductive semiconductor         layer 14 by the conductive connecting layer 17. A part of the         crossover metal layer 21 in the second area (II) extends into         the multiple trenches 15 and electrically connects to the first         conductive semiconductor layer 12. The crossover metal layer 21         on multiple flat planes 16 and the pathways 18 in the second         area (II) is electrically isolated from the second conductive         semiconductor layer 14 by the first isolation layer 19. The         crossover metal layer 21 on the conductive region 20 in the         third area (III) electrically connects with the second         conductive semiconductor layer 14 by the conductive connecting         layer 17. Besides, the region b in the second area (II) and the         third area (III) adjacent to the conductive region 20 is not         fully covered by the crossover metal layer 21 which is used for         electrical isolation.     -   6. Forming a second isolation layer 22 on the crossover metal         layer 21, the part of the first isolation layer 19 in the first         area (I), and on the region b which is not fully covered by the         crossover metal layer 21 in the second area (II). The second         isolation layer 22 does not cover the inner side of the trenches         15 in the third area (III), the first isolation layer 19 of the         multiple flat planes 16, and the region b which is not fully         covered by the crossover metal layer 21 in the third area (III)         as illustrated in the FIGS. 2F and 2F′.     -   7. Forming the first conductive layer 26 on the second isolation         layer 22, in the multiple trenches 15 in the third area (III),         on the first isolation layer 19 of the flat planes 16, and the         region b which is not fully covered by the crossover metal layer         21 in the third area (III) as illustrated in the FIGS. 2G and         2G′.     -   8. Forming a bonding layer 24 on the first conductive layer 26         which is bonded with a permanent substrate 25 by the bonding         layer 24 as illustrated in the FIG. 2H.     -   9. Removing the temporary substrate 11 to expose the first         conductive semiconductor layer 12 and roughs the surface of the         first conductive semiconductor layer 12. Next, etching multiple         pathways 18 form the first conductive semiconductor layer 12         until the first isolation layer 19 is revealed in order to form         N light-emitting diode units. Among the N light-emitting diode         units, the first light-emitting diode unit locates in the first         area (I), the second to the (N−1)^(th) light-emitting diode         units locate in the second area (II), and the N^(th)         light-emitting diode unit locates in the third area (III). Next,         etching the first conductive semiconductor layer 12 in the first         area (I) without the crossover metal layer 21 until the         conductive connecting layer 17 is revealed, and forming a second         electrode layer 28 on the conductive connecting layer 17. Thus         an LED array 2 having N light-emitting diode units electrically         connected in series by the crossover metal layer 21 is formed as         illustrated in FIG. 2I.

The temporary substrate 11 described in the above first and second embodiments is made of, for example, gallium arsenide (GaAs), gallium phosphide (GaP), sapphire, silicon carbide (SiC), gallium nitride (GaN), or aluminum nitride. The epitaxial structure is made of an III-V group semiconductor material which is the series of aluminum gallium indium phosphide (AlGaInP) or the series of aluminum gallium indium nitride (AlGaInN). The conductive connecting layer 17 comprises indium tin oxide, cadmium tin oxide, antimony tin oxide, indium zinc oxide, aluminum zinc oxide, and zinc tin oxide. The first isolation layer 19 and the second isolation layer 22 can be made of an insulating material comprises silicon dioxide, titanium monoxide, titanium dioxide, trititanium pentoxide, titanium sesquioxide, cerium dioxide, zinc sulfide, and alumina. The first conductive layer 26 and the second conductive layer 23 can be made of silver or aluminum. The bonding layer 24 is an electrically conductive material made of metal or its alloys such as AuSn, PbSn, AuGe, AuBe, AuSi, Sn, In, Au, or PdIn. The permanent substrate 25 is a conductive material such as carbides, metals, metal alloys, metal oxides, metal composites, etc. The crossover metal layer 21 comprises metal, metal alloys, and metal oxides.

Although the present application has been explained above, it is not the limitation of the range, the sequence in practice, the material in practice, or the method in practice. Any modification or decoration for present application is not detached from the spirit and the range of such. 

What is claimed is:
 1. A light-emitting structure comprising: an epitaxial structure comprising a plurality of trenches; a conductive connecting layer, disposed under the epitaxial structure; a first isolation layer; a crossover metal layer, disposed under the first isolation layer and comprising a plurality of protruding portions protruding into the epitaxial structure through the plurality of trenches; a second isolation layer, disposed under the crossover metal layer; a bonding layer disposed under the second isolation layer; a substrate, disposed under the bonding layer; and an electrode, electrically connected to the conductive connecting layer and disposed adjacent to the epitaxial structure in a cross-sectional view.
 2. The light-emitting structure of claim 1, wherein the epitaxial structure comprises: a first conductive semiconductor layer; an active layer, disposed under the first conductive semiconductor layer, and a second conductive semiconductor layer, disposed under the active layer.
 3. The light-emitting structure of claim 2, wherein the plurality of trenches extends from the second conductive semiconductor layer to the first conductive semiconductor layer and is devoid of passing through the epitaxial structure.
 4. The light-emitting structure of claim 3, wherein the plurality of protruding portions contacts the first conductive semiconductor layer through the plurality of trenches.
 5. The light-emitting structure of claim 1, wherein the first isolation layer comprises a portion disposed on a side wall of each of the plurality of trenches.
 6. The light-emitting structure of claim 5, wherein the first isolation layer comprises another portion disposed under the conductive connecting layer.
 7. The light-emitting structure of claim 1, wherein the electrode is not covered by the epitaxial structure.
 8. The light-emitting structure of claim 1, wherein the conductive connecting layer surrounds the plurality of protruding portions.
 9. The light-emitting structure of claim 1, wherein a top surface of the epitaxial structure is roughened.
 10. The light-emitting structure of claim 1, wherein a width of the conductive connecting layer is substantially equal to that of the light-emitting structure in a top view.
 11. The light-emitting structure of claim 1, wherein in a top view, the conductive connecting layer comprising a plurality of openings substantially corresponding to the plurality of trenches.
 12. The light-emitting structure of claim 1, wherein the epitaxial structure comprises a plurality of epitaxial units electrically connecting each other in a cross-sectional view.
 13. The light-emitting structure of claim 1, further comprising a conductive layer formed between the epitaxial structure and the substrate.
 14. The light-emitting structure of claim 13, wherein a material of the conductive layer comprises silver or aluminum.
 15. The light-emitting structure of claim 1, wherein a material of the conductive connecting layer comprises indium tin oxide, cadmium tin oxide, antimony tin oxide, indium zinc oxide, aluminum zinc oxide, or zinc tin oxide. 